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DEPOSIT STRESS ANALYZER TEST USING CU-FE 1194 TEST STRIPS |
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Date _____________
Test Strip Material: Copper – Iron Alloy 0.00020 Inch Thick, PN: 1194
Modulus of Elasticity 120,690
Part Number 1194
Nickel Sulfamate Bath Plating Conditions:
Bath Temperature ________
Current Density __________ Amps/square foot
Plating Current __________ Amps
Plating Time: ____________
Deposit Thickness __________ Microinches
Solve the equation S=UK¸3T (M) as follows:
Read the total increments spread on both sides of the zero line. This value is U.
T= Deposit thickness in inches.
M= 1.0388, the correction factor for the difference in modulus of elasticity values between the deposit and substrate.
K= The calibration constant value provided by the manufacture.
S= The internal deposit stress in pounds per square inch.
S=______________PSI |
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DEPOSIT STRESS ANALYZER TEST USING FE-NI 2042B TEST STRIPS |
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Date _____________
Test Strip Material: Iron-Nickel UNS Alloy K94100-H02, 0.00015 Inch Thick
Modulus of Elasticity ___144,828___Dynes/cm²
Part Number 2042B
Nickel Sulfamate Bath Plating Conditions:
Bath Temperature______________
Current Density _______________ Amps/square foot
Plating Current _______________ Amps
Plating Time: ________________
Deposit Thickness _____________ Microinches
Solve the equation S=UK¸3T(M) as follows:
Read the total increments spread on both sides of the zero line. This value is U.
T= Deposit thickness in inches.
K= The calibration constant value provided by the manufacture.
M= 1.0173, the correction factor for the difference in modulus of elasticity values between the deposit and substrate.
S= The internal deposit stress in pounds per square inch.
S=_____________PSI. |
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TEST EQUIPMENT- SEE SPECIALTY TESTING BROCHURE |
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PN: 800L Plating Test Cell (price includes PN: 404 submersible mini pump).
PN: 3046 Electric Immersion Heater (Note: Heater maintains ± 0.5° F).
GraLab Timer 60 Minutes or equivalent with automatic shut off.
PN: 683 Deposit Stress Analyzer.
Rectifier to supply the direct current amperage for plating. A constant current constant voltage power supply is recommended- preferably a zero to five amp output.
A multimeter to verify the accuracy of the amperage specified for plating.
PN: 1194 Copper Alloy Test Strip (Quantity of 15).
Two Nickel Anodes 2 x 2 x 1/8 inch (Can be purchased from Kocour Company).
TEST SET-UP
- Place the anodes in the plating cell anode pockets at the cell ends.
- Place the heater in the plating cell (see brochure photo)
- Set the pump slide bar to its lowest setting. Dampen the suction cups on the submersible pump with water and fasten the pump to the side of the cell so it rests on the cell bottom and the outlet is directed toward the cell wall opening.
- Fill the cell with the plating bath to be evaluated to within one quarter inch of the top of the cell.
- Connect the positive lead from the power supply to the aluminum anode contact provided on the cell. Connect the red leads on the cell to the respective anodes.
- The negative lead will be used to fasten a given test strip to the stainless steel support mounted on the cell.
- Plug the rectifier into the automatic timer.
- Plug the timer, heater and pump into a 120 Volt source.
- Heat the plating solution to the operating temperature.
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TEST PROCEDURE |
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- Soak clean a given Test Strip in a soak cleaner solution at 110 - 120°F. for 1 minute to remove any contamination.
- Water rinse.
- Immerse in a 5% by volume hydrochloric acid solution for 30 seconds at room temperature.
- Water rinse.
- Place the test strip in the plating cell by clipping the test strip to the stainless steel cross support so as to have the test strip centered between the cell walls with the test strip leg tips approximately 1/16th inch from the plating cell bottom.
- Turn the agitation pump ON.
- Set the timer for the appropriate plating time.
- The test strip should be exposed to the plating solutions at least one minute prior to beginning nickel deposition.
- Adjust the plating current to the specified amperage. Maintain the rectifier setting and use the timer to turn off the power supply.
- Maintain the rectifier setting. Turn off the rectifier and begin at step one of the test procedure and continue plating said test strip for the proper time at the predetermined amperage.
- At the end of the plating cycle, remove the test strip from the cell. Rinse the test strip in water, then rinse it in isopropyl alcohol. Lay the test strip on a paper towel and blot it dry with another paper towel.
- Within one minute from the end of plating, place the test strip on the measuring stand and read and record the total increments spread as the value for U.
- Solve the above equation for the internal deposit stress and record this value as pounds/square inch.
Date _____________
Test Strip Material: Iron-Nickel UNS Alloy K94100-H02, 0.00015 Inch Thick
Modulus of Elasticity ___144,828___Dynes/cm²
Part Number 2042B
Nickel Sulfamate Bath Plating Conditions:
Bath Temperature______________
Current Density _______________ Amps/square foot
Plating Current _______________ Amps
Plating Time: ________________
Deposit Thickness _____________ Microinches
Solve the equation S=(UK÷3T)(M) as follows:
Read the total increments spread on both sides of the zero line. This value is U. |
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Test Strip Procedure |
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The PN: 1194 test strips are
comprised of a copper-iron alloy that usually requires activation for chemical deposition to occur. PN: 2042B iron-nickel alloy test
strips, when used for electroless
plating,seldom rewuire activation of the surface for plating to begin. If deposition does not begin, a very brief electrolytic treatment will be necessary as
follows:
Apply a Wood's Nickel Strike at 30 ASF for 30 seconds
to create an active surface.
Treat the test strips
as follows: |
| A. Soak clean in an alkaline or acidic
soak cleaner 1 minute to remove any oil contaminants that
may
have transferred to the plating area. |
| B. Water rinse, |
C. Subject to a Wood's Nickel Strike to
remove the passive oxide film from the surface.
Solution Composition: 240 grams/liter nickel chloride and 86 ml/l or 14 fl oz/gal.
hydrochloric acid solution.
Plating Conditions: room temperature 1 minute anodic at 30 ASF followed by 1 minute
cathodic at 30ASF.
If a wood's Nickel Strike is not necessary, simply immerse the plating area of
the test strip in 10% by volume sulfuric acid for 15-30 seconds. |
| D. Water rinse. |
E. Electroless plate to extend the spreading
of the test strip - tips to 1⁄2 - 1 1⁄2 centimeters.
Note: If using a bath other than electroless nickel and chemical deposition does
not begin, it will be necessary to electrolytically strike the test strip in
an electrolytic bath of similar metal as the electroless bath for 5 seconds, then
water rinse and chemically plate.
For PN: 1194, Copper alloy, a thin metallic electrolytic strike of metal being
chemically deposited (usually 5 seconds at 20ASF) is sufficient to initiative
chemical deposition in an electroless bath. Note that for general use of the 1194
copper alloy, only a mild non-alkaline soak cleaning, water rinse, a 30 second
dip in 10% sulfuric acid, and water rinse prepares the strip for plating. |
| Plating
Conditions for Nickel: |
1. 20ASF or 0.167 ampere for 6 minutes.
2. 50 ASF of 0.416 ampere for 2 minutes, 24 seconds
Note: Either of the above will provide an average deposit thickness of 100 microinches.
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| Plating Conditions for Acid Copper: |
1. 20 ASF of 0.167 ampere for
5 minutes, 22 seconds.
2. 40 ASF of 0.334 ampere for 2 minutes,
42 seconds
Plating Conditions for Electroless Plating - Continue plating sufficient to cause
the test strip legs to spread between 1⁄2 -1 1⁄2 centimeters. The
time will need to be determined experimentally based on the deposition rate and
the internal deposit stress. |
| Plese see
( Deposit Stress Analyzer Brochure )
for other metallic deposits. |